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Application Note 1137
85
1.55V
VCORE, 100mV/DIV
82
NO AIR FLOW
79
1.35V
76
VID5, 5V/DIV
73
0V
70
5
15
25
35
45
55
PGOOD, 2V/DIV
0V
50 μ s/DIV
FIGURE 6. VID-ON-THE-FLY TRANSITION FROM 1.55V TO
1.30V
Figure 7 shows the converter returning to a DAC level of
1.550V after the VID3 and VID1 states are returned to
LOAD CURRENT (A)
FIGURE 8. EFFICIENCY vs LOAD CURRENT
Thermal Performance
Figure 9 shows the laboratory measured upper and lower
MOSFET temperatures versus load current. The
measurements were performed at room temperature and
taken at thermal equilibrium with NO AIR FLOW .
70
ground. Again, the converter is loaded at 26A during the
DAC change.
61
Q1
Q2
Q3
NO AIR FLOW
Q4
1.55V
VCORE, 200mV/DIV
52
43
Q5
Q6
1.35V
34
0V
VID4, 5V/DIV
25
5
15
25 35
LOAD CURRENT (A)
45
55
FIGURE 9. MOSFET TEMPERATURE vs LOAD CURRENT
0V
PGOOD, 10V/DIV
50 μ s/DIV
FIGURE 7. VID-ON-THE-FLY TRANSITION FROM 1.30V TO
Figure 10 shows the individual channel output inductor and
HIP6601B driver temperatures over the same conditions as
the MOSFETs.
75
1.55V
D1
NO AIR FLOW
Efficiency
The efficiency of the ISL6559EVAL2 board, loaded from 5 to
55A, is plotted in Figure 8. Measurements were performed at
room temperature and taken at thermal equilibrium with NO
AIR FLOW . The design exceeds the AMD Hammer Desktop
minimum requirements of 50% efficiency under minimum
loading and 80% efficiency at maximum loading even
without forced airflow. The maximum allowed airflow per the
65
55
45
35
D2
D3
L1
L2
L3
desktop specification is 100LFM and will only enhance the
converter performance if available.
25
5
15
25 35
LOAD CURRENT (A)
45
55
FIGURE 10. INDUCTOR/DRIVER TEMPERATURE vs LOAD
CURRENT
5
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